摘要
晶圆制造工艺复杂，关键参数控制直接影响产品质量。统计过程控制（SPC）可实现参数的实时监测与分析。本文针对光刻胶薄膜厚度、光刻显影后线宽、套刻精度等关键参数，运用 SPC 控制图表跟踪变化趋势，通过过程能力指数评估工艺质量。据此制定参数优化、异常处理及持续改进策略。经生产验证，改进后的控制策略显著提升了参数稳定性，有效提高产品质量与生产效率，增强企业竞争力。
关键词： 晶圆制造；统计过程控制（SPC）；关键参数；控制策略；过程能力指数
Abstract
The wafer manufacturing process is complex, and controlling key parameters directly impacts product quality. Statistical Process Control (SPC) enables real-time monitoring and analysis of these parameters. This paper focuses on key parameters such as photoresist film thickness, line width after lithography and development, and overlay accuracy. By using SPC control charts to track trends and assessing process capability indices, the paper formulates strategies for parameter optimization, anomaly handling, and continuous improvement. Production validation has shown that the improved control strategy significantly enhances parameter stability, effectively improves product quality and production efficiency, and strengthens the company's competitiveness.
Key words： Wafer manufacturing; Statistical Process Control (SPC); Key parameters; Control strategy; Process capability index
参考文献 References
[1] 郭燕涛,曾聪,熊文清.晶圆加工腔室自清洗模块的系统设计[J].自动化应用,2025,66(05):190-193.
[2] 刘海军.电子产品制造过程中CMP材料的应用研究[J].电子产品世界,2025,32(03):21-24.
[3] 胡志强,吴一全.基于机器视觉的半导体晶圆缺陷检测方法综述[J].中国图象图形学报,2025,30(01):25-50.
[4] 吴立辉,周秀,张中伟,等.基于WOA-SVM的混合式晶圆允收测试关键特征参数选择方法[J].制造业自动化, 2024, 46(12):17-23.
[5] 江婷,张新,梅琳.半导体晶圆转运设备制造材料的国产替代——以防滑移壁虎脚垫片制造为例[J].塑料工业, 2024, 52(12):196-197.
[6] 高鹏捷,汪俊亮,张洁.面向晶圆制造工期预测的可解释深度学习方法[J].机械工程学报,2024,60(22):179-191.
[7] 戴敏洁.集成电路制造过程中的质量工具应用[J].集成电路应用,2020,37(06):27-29.
[8] 戴敏洁.晶圆制造中APQP提升研发产品质量的应用[J].集成电路应用,2020,37(05):40-42.