Research on Device Process Characteristics and Improving PCB Manufacturing Process Level
浅谈器件工艺特性及提高PCB制造工艺水平研究

摘要

印制板的研制与开发与器件的高速发展是分不开的。因为所研发的印制板必须满足器件的电装技术要求、使器件的功能参数更能够充分地发挥作用、以确保电子设备的运转箕间的高稳定性和高可靠性．特别要提出的就是表面封装（SMT）与微组装（ CSP或CMT）器件的进步﹐对卬制板的制造工艺提出更高的技术要求。为此，印制板制造工艺。必须适应高速发展的微电子技术的需要。所以，研究器件的工艺特性，就是研发结构新颖印制板的重要途径。因此，本文从器件工艺的特性出发，主要研究探讨如何提高印制电路板的制造工艺水平。

Abstract

The development and development of printed board is inseparable from the rapid development of devices. Because the developed printed board must meet the electrical assembly technical requirements of the device, so that the functional parameters of the device can play a full role, to ensure the high stability and high reliability of the operation pan of the electronic equipment. In particular, the progress of surface packaging (SMT) and microassembly (CSP or CMT) devices puts forward higher technical requirements for the manufacturing process of the printed plate. To this end, the printed board manufacturing process. Must adapt to the needs of the rapidly developing microelectronics technology. Therefore, studying the process characteristics of the device is an important way to develop a novel screen structure. Therefore, based on the characteristics of device process, how to improve the manufacturing process of printed circuit board.